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Fabrication and structure characterization of ITO transparent conducting film by sol-gel technique LI Zhi-hua(李芝华)1, REN Dong-yan(任冬燕)2 1. School of Materials Science and Engineering, Central.../□, a resistivity of 1.65×10-3 Ω?cm and a transparency of 90%. Key words: indium tin oxide; sol-gel; structure characterization; fabrication  ......
Fabrication and properties of Si/Al interpenetrating phase composites for electronic packaging WANG Xiao-feng(王小锋)1, 2, WU Gao-hui(武高辉)2, WANG Ri-chu(王日初)1, XIU Zi-yang(修子扬)2, YU Kun(余 ..., China Received 15 July 2007; accepted 10 September 2007 Abstract: In order to improve the thermal properties of MMCs for electronic packaging, the concept of fabrication MMCs with particular......
Compound fabrication technology of semi-solid billet of Al-Si alloy based on SIMA method XUE Ke-min(薛克敏), MI Guang-bao(弭光宝), WANG Qing-rui(王清瑞) School of Materials Science and Engineering, Hefei... with the single near-liquidus casting or SIMA, the microstructure of primary α-Al phase in AlSi9Mg alloy prepared by compound fabrication process is more homogeneous, with more globular and finer particles......
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Fabrication and Mechanical Properties of Sm2O3 Doped CeO2 Reinforced Ti3AlC2 Nano Composite Young Do Kim1,Sang Whan Park2,Jae Ho Han1 (1.Division of Materials Science & Engineering,Hanyang University,Seoul,133-791,Korea;2.Korea Institute of Science and Technology,Multi-Functional Ceramics Research Center,Seoul,136-791,Korea) Abstract:The fabrication process of Sm2O3 doped CeO2 reinforced......
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Fabrication and test of reaction bond silicon carbide for optical applications YAO Wang(姚 旺), ZHANG Yu-min(张宇民), HAN Jie-cai(韩杰才), ZUO Hong-bo(左洪波) Center for Composite Materials, Harbin...; Abstract: A reaction bonding fabrication process using various grain size of SiC powder was investigated. The properties such as mechanical, thermal and physic property were tested......
process in semiconductor wafer fabrication systems using extended hybrid Petri nets ZHOU Bing-hai(周炳海), PAN Qing-zhi(潘青枝), WANG Shi-jin(王世进), WU Bin(吴 斌) (School of Mechanical Engineering, Shanghai...; Abstract: To describe a semiconductor wafer fabrication flow availably, a new modeling method of extended hybrid Petri nets (EHPNs) was proposed. To model the discrete part......
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Fabrication of BSCCO Nanocrystal SuperconductorsCheng ZHANG Xin WANG Yongzhong WANG Guiwen QIAO Institute of Metal Research,Academia Sinica,Shenyang,110015,China摘 要:<正> Nanocrystal materials have their special properties because of very small grain size.Nanocrystalsuperconductors were prepared by crystallizing the amorphous slices with nominal......